PDF Solutions Secures Landmark Contract with Global IDM Customer
Large 2025 Contract Validates High-Volume Manufacturing Strategy
SANTA CLARA, Calif., Sept. 22, 2025 (GLOBE NEWSWIRE) -- PDF Solutions, Inc. (Nasdaq: PDFS) today announced a landmark contract signing: a significant multi-year agreement to expand a prior contract and deploy eProbe® tools, Characterization Vehicle® infrastructure, and associated Exensio® analytics software across multiple high-volume manufacturing facilities of a major global semiconductor manufacturer.
Breakthrough Technology Scales to Mass Production
PDF Solutions' eProbe technology delivers contactless testing of 3D semiconductor structures using electron beam, optimized for each wafer's specific design characteristics. This agreement encompasses multiple eProbe systems with deployment in 2025, supported by PDF Solutions' comprehensive software suite for machine optimization and results analysis.
The contract marks a pivotal milestone that validates PDF Solutions' strategic vision and demonstrates the critical role of eProbe technology in both advanced node development and high-volume manufacturing.
Integration of Process characterization, Design and in-line Fabrication data
PDF Solutions combines the eProbe DirectScan™ application with Characterization Vehicle test chips and Exensio analytics software to enable faster yield learning in high-volume manufacturing environments.
This landmark contract validates the approach of integrating process characterization data with design layout data and in-line fabrication data to enhance detectability to ppb levels to accelerate root cause for yield diagnosis and variability control.
Secure Connected Solutions Drive Value
PDF Solutions will deploy eProbe tools and associated software at the Foundry’s manufacturing sites, using PDF Solutions’ secureWISE® network to provide secure remote equipment support and maintenance. This deployment exemplifies PDF Solutions' strategic vision: creating a cross-industry analytics and collaboration platform that connects key players in the semiconductor ecosystem.
Comprehensive connectivity is essential for achieving faster yield ramps and delivering on the promise of AI in semiconductors. To successfully implement AI solutions, the industry needs automated connections between data sources, tools, and enterprise software systems across the entire semiconductor supply chain.
Reaffirming Financial Outlook
PDF Solutions reaffirms its full-year 2025 revenue growth guidance of 21% to 23% compared to 2024.
About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.
Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit https://www.pdf.com.
Headquartered in Santa Clara, California, PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.
Forward-Looking Statements
This press release includes forward-looking statements regarding the Company’s future expected business performance and financial results, including expectations about total revenue growth for 2025, portfolio strength, and momentum, and other statements identified by words such as “could,” “expects,” “intends,” “may,” “plans,” “potential,” “should,” “will,” “would,” or similar expressions and the negatives of those terms, that are subject to future events and circumstances. Other than statements of historical fact, all statements contained in this press release are forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995. Actual results could differ materially from those expressed in these forward-looking statements. Risks and uncertainties that could cause results to differ materially include risks associated with: the effectiveness of the Company’s business and technology strategies; current semiconductor industry trends and competition; rates of adoption of the Company’s solutions by new and existing customers; project milestones or delays and performance criteria achieved; cost and schedule of new product development and investments in research and development; the continuing impact of macroeconomic conditions, including inflation, changing interest rates and tariffs, the evolving trade regulatory environment and geopolitical tensions, and other trends impacting the semiconductor industry, the Company’s customers, operations, and supply and demand for its products; supply chain disruptions; changes in laws and regulations, including recent tax and data privacy laws and regulations, or the interpretation or enforcement thereof; the success of the Company’s strategic growth opportunities and partnerships; recent and future acquisitions, strategic alliances and relationships and the Company’s ability to successfully integrate acquired businesses and technologies; whether the Company can successfully convert backlog into revenue; customers’ production volumes under contracts that provide Gainshare; the sufficiency of the Company’s cash resources and anticipated funds from operations; the Company’s ability to obtain additional financing if needed; and other risks and uncertainties discussed in PDF Solutions’ periodic public filings with the Securities and Exchange Commission, including, without limitation, its Annual Report on Form 10-K for the year ended December 31, 2024, Quarterly Reports on Form 10-Q, and Current Reports on Form 8-K and any amendments to such reports. All forward-looking statements made in this press release and the conference call are made as of the date hereof, and PDF Solutions does not assume any obligation to update such statements nor the reasons why actual results could differ materially from those projected in such statements.
Characterization Vehicle, DirectScan, DEX, eProbe, Exensio, PDF Solutions, secureWISE, and the PDF Solutions logo are trademarks or registered trademarks of PDF Solutions, Inc. and/or its subsidiaries in the United States and other countries. Other trademarks used herein are the property of their owners.
| Company Contacts: | |||
| Sonia Segovia Investor Relations |
Adnan Raza Chief Financial Officer |
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| Tel: (408) 938-6491 | Tel: (408) 9280-7900 | ||
| Email: sonia.segovia@pdf.com@pdf.com | Email: adnan.raza@pdf.com | ||
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